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processor and igp die:
Block Diagram:
Things to remember:
1. 32nm
2. 2 cores, 4 threads
3. 2 dice, single package (core and igp die)
4. memory controller and pcie controller isn't integrated to the processor but on the IGP die to support and enhance the IGP performance (tradeoff: memory latency
)
5. added FDI link for the IGP output (flexible display interface)
6. new chipset for the LGA1156 (H57, H55 and Q57)
7. improved intel gma, or they now call it intel HD.
8. very suitable for HTPCs
9. very fun to overclock