Potential source of Ivy Bridge heat problems discovered

[siopao1984]

---

The general consensus from Ivy Bridge reviews is that the processor is indeed faster than Sandy Bridge by a small margin, but seems to struggle quite significantly with higher temperatures, something which seems counter-intuitive if you consider it has marginally lower power consumption and a smaller 22nm HKMG process. Overclockers seem to think they have discovered why this is the case. Most processors come with an integrated heat sink or casing that makes them all look uniform and neat whilst protecting internal parts of the processor from damage. When removing this outer case for Ivy Bridge, the process is simple and it shouldn’t be. The reason for this is the IHS (Integrated heat sink) has an additional layer of thermal paste underneath it, unlike on Sandy Bridge where the IHS was soldered onto the actual processor component. The resulting heat transfer is the following:
Ivy Bridge: CPU Die -> Thermal Paste -> IHS -> Thermal Paste -> Liquid or Air Cooler
Sandy Bridge: CPU Die -> Thermal Paste -> Liquid or Air Cooler
Sandy Bridge has more efficient heat transfer as there are less stages for the heat to pass through meaning it can be dissipated quicker. We are not sure whether this rather old fashioned thermal paste under the IHS solution is just for Ivy Bridge engineering samples or whether every single Ivy Bridge processor will come like this. If every processor will come like this, it means that for the novice user your overclocking limit will be slightly less than Sandy Bridge due to the higher temperatures Ivy Bridge produces, for the “extreme overclockers” or enthusiast it will mean that the only way you will be able to break records is by removing the IHS and getting your CPU cooler to make direct contact with the CPU die in a similar way it did before on Sandy Bridge.
Source: Overclockers.com

[fearnel]

basin toothpaste ra ang paste ana mau init.

[Vino Kid]

palit mo daun ukba ilisi ug thermal paste hehehehe....

[3kster]

hayz,...w as planning to buy IB raba den sugod2 ug tuon ug overclocking,... pero if ngani can't risk the proce nlng

[lloyd_joy]

hayz,...w as planning to buy IB raba den sugod2 ug tuon ug overclocking,... pero if ngani can't risk the proce nlng

ok ra na bro oi... mas bugnaw pa man gani ning IB sa mga current offerings sa AMD ug sa mga 1st gen core series sa intel... this thermal thing is not a big deal... any good air cooling system or a water system (closed loop or open) will be good enough for OC... then once ma ilisan nila ang thermal compound na gamit ron, for sure, mo ubos pa gamay ang temp... kana kun conclusive to na finding ha... but a silver based thermal compound will really help to lower down the temp a little bit though...

just for a quick reference on the TDP sa 1st gen cores series... 13, 15 & i7...

1st gen desktop i3s have their TDP at 73W
1st gen desktop i5s have their TDP at 73W (low voltage), 87W & 95W
1st gen desktop i7s have their TDP at 82W (low voltage), 95W & 130W
1st gen desktop i7s extreme edition have their TDP at 130W

[bim27142]

maytag ma resolve nani sa next stepping bu june or july kay anang mga panahona na baya ko mo palit og IB

[vipvip68]

Dont buy right away basta bag-o pa nga process. Theres a big chance of minor bugs which will be ironed out sa 2nd revision.

[lloyd_joy]

Dont buy right away basta bag-o pa nga process. Theres a big chance of minor bugs which will be ironed out sa 2nd revision.

this is true... 90% of the time... kay kun mag hinay2x, kuyaw ma unhan sa competition... ang fix kay naa sa mga succeeding revisions either sa product itself (design) or sa test program... this is from my experience in the semiconductor industry... hehehe

[3kster]

mao jud nay ingon nga relax2 lang sa,. maniid bah,. mura gud sugarol,. hahaha

[chang87]

ayaw lang mo pataranta! heheheh. chill!