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  1. #1

    Post AMD Arctic Islands (Polaris) 400 Series Set To Launch In Summer of 2016


    AMD Arctic Islands 400 Series Set To Launch In Summer of 2016 – Features 2X The Performance Per Watt, 14nm / 16nm FinFET And HBM2

    ...
    AMD Radeon 400 Series Arctic Islands To Feature 14nm / 16nm FinFET Process

    AMD’s chief technology officer, Mark Papermaster, announced last month that AMD will in fact be leveraging Globalfoundries’ 14LPP process for CPU, APU and GPU products. Which was a very interesting development to say the least as It was confirmed back in August that AMD is also in fact one of TSMC’s clients for the 16nm node. The very same process that Nvidia had officially confirmed earlier in the year that it will be using for its next generation Pascal GPUs in 2016.

    Mark Papermaster, senior vice president and chief technology officer at AMD :
    FinFET technology is expected to play a critical foundational role across multiple AMD product lines, starting in 2016, GLOBALFOUNDRIES has worked tirelessly to reach this key milestone on its 14LPP process. We look forward to GLOBALFOUNDRIES’ continued progress towards full production readiness and expect to leverage the advanced 14LPP process technology across a broad set of our CPU, APU, and GPU products. – Press Release
    From a historical point view, every one of AMD’s graphics product launches on a next generation manufacturing process in the current and past two decades was delivered on a TSMC process node. Now that we have official confirmation that AMD will be building FinFET GPUs at both TSMC and Globalfoundries next year it’s going to be a fascinating spectacle to see which GPUs would debut on which process and why AMD decided to go against its tradition and partner with both foundries for its next generation Arctic Islands GPUs.

    AMD Catalyst 15.8 Beta Driver Released; Brings Preformance Optimizations for Arkham Knight and Ashes of the Singularity

    14LPE is the early access “low power” version of the common Samsung/Globalfoudnries 14nm FinFET process, while 14LPP is the second generation, high performance variant that is set to succeed 14LPE. Despite its name, 14LPP should deliver better performance as well as lower power consumption, the only caveat being its later availability.

    14nm FinFET will offer GPU design engineers nearly double transistors to play with in the same area as the current 28nm process. 14nm FinFET also has significantly faster switching speeds, which will translate to significantly higher clock speeds compared to current 28nm based GPUs. This is all in addition to the drastic power savings enabled by the smaller feature sizes and the move from planar to FinFET gates.
    14nm FinFET Technology

    Globalfoundries.com
    14LPE – Early time-to-market version with area and power benefits for mobility applications

    14LPP – Enhanced version with higher performance and lower power; a full platform offering with MPW, IP enablement and wide application coverage

    TSMC’s 16nm FinFET process node offers equally impressive figures with double the transistor density of current 28nm technology as well as faster switching speeds and finally significantly lower power consumption.
    TSMC.com
    TSMC’s 16FF+ (FinFET Plus) technology can provide above 65 percent higher speed, around 2 times the density, or 70 percent less power than its 28HPM technology. Comparing with 20SoC technology, 16FF+ provides extra 40% higher speed and 60% power saving. By leveraging the experience of 20SoC technology, TSMC 16FF+ shares the same metal backend process in order to quickly improve yield and demonstrate process maturity for time-to-market value.
    It will be interesting to see how things play out next year with Nvidia’s Pascal GPUs which will also be produced on TSMC’s 16nm FinFET process and feature second generation High Bandwidth Memory. How much exactly Pascal and Arctic Islands GPUs are going to cost will depend almost entirely on the production yields and volumes of the leading edge FinFET node next year. But so far this is shaping up to be one of the biggest performance and power efficiency boosts we’re going to see from a new generation of graphics cards in a long while.
    WCCFTech Year Process Flagship GPU Product Memory Bandwidth
    Southern Islands 2012 28nm Tahiti HD 7970 3GB GDDR5 264GB/s
    Volcanic Islands 2013 28nm Hawaii R9 290X 4GB GDDR5 320GB/s
    Pirate/Caribbean Islands 2015 28nm Fiji R9 Fury X 4GB HBM1 512GB/s
    Arctic Islands 2016 14/16nm Greenland ? 16GB HBM2 1TB/s


    Read more: AMD Arctic Islands 400 Series Set To Launch In Summer of 2016 - Features 2X The Performance Per Watt, 14nm / 16nm FinFET And HBM2

  2. #2
    gasto nasad ni... maka katol napud ni's kamot sa mga masakiton... masakiton ug "upgraditis"... bwehehehe...

  3. #3
    @d3an_v3r ug @lloyd_joy
    nalipong nakog binasa..., na-a bai summary ani!? ^_^
    ps..., nagka-bugo na basin ko ^_^

  4. #4
    ^ bro dab, mao ra gyud ni akoang ma summarized ai... "Gasto nasad" kun mag pa igo sa sakit... Hahahaha

  5. #5

  6. #6
    wew na yawas na ! .. excited naku ani dah

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