tape cya? hala ka kuyaw pu oiz..Originally Posted by fish
kanang thermal epoxy naa na? kanang chure kaau nga pilit bahala na dli ma ibot basta tugnaw ug pilit..
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tape cya? hala ka kuyaw pu oiz..Originally Posted by fish
kanang thermal epoxy naa na? kanang chure kaau nga pilit bahala na dli ma ibot basta tugnaw ug pilit..
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naa pud thermal adhesives... pero wala ko kabalo kung naa ba baligya diri..Originally Posted by EntrePinoy
the only problem with that design is the Thermal interface material used. Obviously it was acting as an insulator. it all boils down to what kind of material is used between the chips and the heat spreader. if you believe that the article above applies to all memory, you might as well remove the heat sinks in your north bridge and south bridge chips and also your processor!
what if ing ani ang memory heatspreader?
nakit an ra nako...
[img width=500 height=333]http://www.hothardware.com/articleimages/Item975/Reaper_front.jpg[/img]
we will never know unless someone really test it... kung walay mo test, then mao na na siyay time nga mosalig nalang ka sa manufacturer...Originally Posted by darkdevil
mupalit raba unta ko ani
http://www.thermalright.com/default.htm
HR-07 Duo TYPE H Technical Spec
Dimension
L128 x W19 x H85.28mm ( High Version)
Weight
85g ( High Version)
HR-07 Duo TYPE L Technical Spec
Dimension
L128 x W19 x H56.28mm (Short Version)
Weight
80g (Short Version)
System Used
Processor: Intel Q6600 (3300MHz 1.55V)
Processor Cooling: Ultra120 eXtreme
Motherboard: ASUS P5B-D
RAM: 1GB TeamGroup DDR2*2-Micon D9GMH (at 1100-Mhz CL5-5-5-15 2.35V)
Hard Drive: Seagate 320GB SATA
Graphics Card: 8800GTX
toinks.. salig na lang jud ta ani sa manufacturer. anyway, tag-as man pud ilang warranty. pailis lang ta kung madaut. hehehehe...![]()
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