
Originally Posted by
lloyd_joy
sa sa atoa lang nang tan-aw na stress ang mobo bro... but in reality, it is not. during the design stage, gi check ni nila ang stress points through simulation (FEA software) and then actual eng'g evaluation... complete ang data ani nila during design stage... so, wla'y probs... documentation wise, naa ni sila'y Design FMEA to cover everything... manufacturing wise, naa pu'y Process FMEA...
so, do not worry... hehehehe...
if gusto ka na ang hot air pading sa taas, i-reposition ang cooler... haven't tried it though... dili ko sure if pwede ba sa mounting clips nya...